Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness, 3rd Edition

Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness, 3rd Edition | Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik DeDoncker
English | 2026 | PDF, EPUB | 377 pages | 112.1 Mb

Comprehensive guide to advanced packaging and cooling for Si, SiC, and GaN power devices
Detailed reliability testing methods and failure analysis for next-generation power semiconductors
Covers electromagnetic disturbances and system integration for robust power electronics design

This new edition of the book Semiconductor Power Devices is now divided into two volumes. Volume 2 focuses on Packaging, Cooling, Reliability, and Advanced Design Aspects of Power Devices. Readers will find in-depth coverage of packaging technologies, including conventional and advanced concepts for Si, SiC, and GaN devices, thermal simulation methods, and parasitic electrical elements in power modules. The book explores cooling strategies from air to liquid and double-sided cooling, followed by comprehensive chapters on reliability testing, failure mechanisms, and lifetime prediction models. It also addresses destructive phenomena such as thermal breakdown, surge currents, overvoltage, and short-circuit behavior, along with cosmic ray failures and their mitigation. Additional chapters discuss electromagnetic disturbances, oscillations, and the integration of power electronic systems, making this volume an essential resource for engineers and researchers working on robust and efficient power device design.

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